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dc.contributor.authorWang, M. C.en_US
dc.contributor.authorChang, T. C.en_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorTsao, S. W.en_US
dc.contributor.authorLin, Y. P.en_US
dc.contributor.authorChen, J. R.en_US
dc.date.accessioned2014-12-08T15:15:07Z-
dc.date.available2014-12-08T15:15:07Z-
dc.date.issued2007en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/11354-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2756294en_US
dc.description.abstractThe instability of amorphous Si thin film transistors under uniaxial strain has been studied. Compared to the effect of tensile bias stress, larger threshold voltage shift is observed under compressive bias stress. These results are related to the damage of weak Si-Si bonds during the ac bias stress. However, the V-th shift of devices on the re-flattened substrate is larger after tensile strain than that of compressive strain. In addition, the defeat diminished effect of tensile situation is decreased after re-flattening the device. Therefore, after re-flattening the substrate the Vth shift resulting from tensile bias stress is larger than that of the compressive one. (c) 2007 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleThe instability of a-Si : H TFT under mechanical strain with high frequency ac bias stressen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2756294en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume10en_US
dc.citation.issue10en_US
dc.citation.spageJ113en_US
dc.citation.epageJ116en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000248659800028-
dc.citation.woscount3-
顯示於類別:期刊論文