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dc.contributor.authorGu, Shaw-Hungen_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.authorLu, Wen-Pinen_US
dc.contributor.authorKu, Yen-Hui Josephen_US
dc.contributor.authorLu, Chih-Yuanen_US
dc.date.accessioned2014-12-08T15:15:37Z-
dc.date.available2014-12-08T15:15:37Z-
dc.date.issued2006-10-16en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2360180en_US
dc.identifier.urihttp://hdl.handle.net/11536/11668-
dc.description.abstractThe authors propose a technique to extract a silicon nitride trap density from stress induced leakage current in a polycrystalline silicon-oxide-nitride-oxide-silicon flash memory cell. An analytical model based on the Frenkel-Poole emission is developed to correlate a nitride trap density with stress induced leakage current. The extracted nitride trap density is 7.0x10(12) cm(-2) eV(-1). They find that nitride trapped charges have a rather uniform distribution in an energy range of measurement (similar to 0.2 eV). (c) 2006 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleExtraction of nitride trap density from stress induced leakage current in silicon-oxide-nitride-oxide-silicon flash memoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2360180en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume89en_US
dc.citation.issue16en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000241405200121-
dc.citation.woscount18-
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