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dc.contributor.authorWu, Wei-Haoen_US
dc.contributor.authorTsui, Bing-Yueen_US
dc.contributor.authorChen, Mao-Chiehen_US
dc.contributor.authorHou, Yong-Tianen_US
dc.contributor.authorJin, Yinen_US
dc.contributor.authorTao, Hun-Janen_US
dc.contributor.authorChen, Shih-Changen_US
dc.contributor.authorLiang, Mong-Songen_US
dc.date.accessioned2014-12-08T15:15:37Z-
dc.date.available2014-12-08T15:15:37Z-
dc.date.issued2006-10-16en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2364064en_US
dc.identifier.urihttp://hdl.handle.net/11536/11671-
dc.description.abstractThreshold voltage instability measured by the pulse current-voltage technique has been recognized as the transient charging and discharging of the preexisting bulk traps in Hf-based high-k gate dielectrics, and these high-k traps or called border traps can instantly exchange charge carriers with the underlying Si substrate by tunneling through the thin interfacial oxide. Based on an elastic tunneling model through trapezoidal potential barriers, the spatial and energetic distribution of border traps in the HfO2/SiO2 high-k gate stack can be profiled as a smoothed, three-dimensional mesh by measuring the low-frequency capacitance-voltage characteristics of high-k metal-oxide-semiconductor capacitors with n-type Si substrate.en_US
dc.language.isoen_USen_US
dc.titleSpatial and energetic distribution of border traps in the dual-layer HfO2/SiO2 high-k gate stack by low-frequency capacitance-voltage measurementen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2364064en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume89en_US
dc.citation.issue16en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000241405200078-
dc.citation.woscount6-
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