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dc.contributor.authorTu, Chun-Haoen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorLiu, Hsin-Chouen_US
dc.contributor.authorTsai, Chia-Chouen_US
dc.contributor.authorChang, Li-Tingen_US
dc.contributor.authorTseng, Tseung-Yuanen_US
dc.contributor.authorSze, Simon M.en_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2014-12-08T15:16:10Z-
dc.date.available2014-12-08T15:16:10Z-
dc.date.issued2006-07-31en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2227059en_US
dc.identifier.urihttp://hdl.handle.net/11536/12002-
dc.description.abstractThe formation of germanium nanocrystals embedded in silicon-oxygen nitride with distributed charge storage elements is proposed in this work. A large memory window is observed due to isolated Ge nanocrystals in the SiON gate stack layer. The Ge nanocrystals were nucleated after high temperature oxidized SiGeN layer. The nonvolatile memory with the Ge nanocrystals embedded in SiON stack layer exhibits 4 V threshold voltage shift under 10 V write operation. Also, the manufacture technology using the sequent high-temperature oxidation of the a-Si layer acting as the blocking oxide is proposed to enhance the performance of nonvolatile memory devices. (c) 2006 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleFormation of germanium nanocrystals embedded in silicon-oxygen-nitride layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2227059en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume89en_US
dc.citation.issue5en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000239520200053-
dc.citation.woscount16-
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