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dc.contributor.authorLiu, YLen_US
dc.contributor.authorChang, GPen_US
dc.contributor.authorHsu, KYen_US
dc.contributor.authorChang, FCen_US
dc.date.accessioned2014-12-08T15:16:23Z-
dc.date.available2014-12-08T15:16:23Z-
dc.date.issued2006-06-15en_US
dc.identifier.issn0887-624Xen_US
dc.identifier.urihttp://dx.doi.org/10.1002/pola.21484en_US
dc.identifier.urihttp://hdl.handle.net/11536/12146-
dc.description.abstractEpoxy/polyhedral oligomeric silsesquioxane (POSS) nanocomposites were obtained from octakis(glycidyldimethylsiloxy)octasilsesquioxane (OG) and diglycidyl ether of bisphenol A cured with small-molecule curing agents of diethylphosphite (DEP) and dicyandiamide (DICY). An increase in the POSS contents of the nanocomposites and an improvement in the nanocomposite homogeneity were observed with the use of the small-molecule curing agents. Phosphorus in DEP and nitrogen in DICY also performed synergism with POSS for thermal stability enhancement and flammability improvement in the nanocomposites. The nanocomposites possessing high OG contents exhibited good thermal stability, improved flammability, and high storage moduli. (c) 2006 Wiley Periodicals, Inc.en_US
dc.language.isoen_USen_US
dc.subjectcuring of polymersen_US
dc.subjectnanocompositesen_US
dc.subjectsiliconsen_US
dc.subjectcrosslinkingen_US
dc.titleEpoxy/polyhedral oligomeric silsesquioxane nanocomposites from octakis(glycidyidimethylsiloxy)octasilsesquioxane and small-molecule curing agentsen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/pola.21484en_US
dc.identifier.journalJOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRYen_US
dc.citation.volume44en_US
dc.citation.issue12en_US
dc.citation.spage3825en_US
dc.citation.epage3835en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000237980600011-
dc.citation.woscount34-
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