完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChen Chihen_US
dc.contributor.authorChiu Wei-Lanen_US
dc.date.accessioned2015-05-12T02:59:37Z-
dc.date.available2015-05-12T02:59:37Z-
dc.date.issued2015-02-17en_US
dc.identifier.govdocH05K003/02zh_TW
dc.identifier.govdocH05K001/11zh_TW
dc.identifier.govdocH05K001/09zh_TW
dc.identifier.govdocH05K003/40zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/122818-
dc.description.abstractAn electrical connecting element, a method of fabricating the same, and an electrical connecting structure comprising the same are disclosed. The method of fabricating the electrical connecting structure having twinned copper of the present invention comprises steps of: (A) providing a first substrate; (B) forming a nano-twinned copper layer on part of a surface of the first substrate; (C) forming a solder on the nano-twinned copper layer of the first substrate; and (D) reflowing the nano-twinned Cu layer and solder to produce a solder joint, wherein at least part of the solder reacts with the nano-twinned copper layer to produce an intermetallic compound (IMC) layer which comprises a Cu3Sn layer, This invention reduces the voids formation in the interface between the intermetallic compound and the solder, and then enhances the reliability of solder joints.zh_TW
dc.language.isozh_TWen_US
dc.titleElectrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the samezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08957323zh_TW
顯示於類別:專利資料


文件中的檔案:

  1. 08957323.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。