Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

doi:10.1063/1.2198809

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Liang, SW	en_US
dc.contributor.author	Chang, YW	en_US
dc.contributor.author	Chen, C	en_US
dc.date.accessioned	2014-12-08T15:16:48Z	-
dc.date.available	2014-12-08T15:16:48Z	-
dc.date.issued	2006-04-24	en_US
dc.identifier.issn	0003-6951	en_US
dc.identifier.uri	http://dx.doi.org/10.1063/1.2198809	en_US
dc.identifier.uri	http://hdl.handle.net/11536/12356	-
dc.description.abstract	Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6 A at 70 degrees C, we estimate that the MTTF of the joints with Al traces in 100 mu m width was 6.1 times longer than that of joints with Al traces in 34 mu m width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF. (c) 2006 American Institute of Physics.	en_US
dc.language.iso	en_US	en_US
dc.title	Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1063/1.2198809	en_US
dc.identifier.journal	APPLIED PHYSICS LETTERS	en_US
dc.citation.volume	88	en_US
dc.citation.issue	17	en_US
dc.citation.epage		en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000237136600038	-
dc.citation.woscount	29	-
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