標題: | Effects of current crowding and Joule heating on reliability of solder joints |
作者: | Liang, S. W. Chiu, S. H. Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering |
關鍵字: | electromigration;flip-chip solder joints;Joule heating |
公開日期: | 2007 |
摘要: | This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration. |
URI: | http://hdl.handle.net/11536/5346 |
ISBN: | 978-0-7354-0459-5 |
ISSN: | 0094-243X |
期刊: | STRESS-INDUCED PHENOMENA IN METALLIZATION |
Volume: | 945 |
起始頁: | 180 |
結束頁: | 193 |
顯示於類別: | 會議論文 |