標題: Effects of current crowding and Joule heating on reliability of solder joints
作者: Liang, S. W.
Chiu, S. H.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: electromigration;flip-chip solder joints;Joule heating
公開日期: 2007
摘要: This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.
URI: http://hdl.handle.net/11536/5346
ISBN: 978-0-7354-0459-5
ISSN: 0094-243X
期刊: STRESS-INDUCED PHENOMENA IN METALLIZATION
Volume: 945
起始頁: 180
結束頁: 193
顯示於類別:會議論文