標題: | Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration |
作者: | Liang, SW Chang, YW Chen, C 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 24-四月-2006 |
摘要: | Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6 A at 70 degrees C, we estimate that the MTTF of the joints with Al traces in 100 mu m width was 6.1 times longer than that of joints with Al traces in 34 mu m width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF. (c) 2006 American Institute of Physics. |
URI: | http://dx.doi.org/10.1063/1.2198809 http://hdl.handle.net/11536/12356 |
ISSN: | 0003-6951 |
DOI: | 10.1063/1.2198809 |
期刊: | APPLIED PHYSICS LETTERS |
Volume: | 88 |
Issue: | 17 |
結束頁: | |
顯示於類別: | 期刊論文 |