標題: Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
作者: Liang, SW
Chang, YW
Chen, C
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 24-四月-2006
摘要: Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6 A at 70 degrees C, we estimate that the MTTF of the joints with Al traces in 100 mu m width was 6.1 times longer than that of joints with Al traces in 34 mu m width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF. (c) 2006 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2198809
http://hdl.handle.net/11536/12356
ISSN: 0003-6951
DOI: 10.1063/1.2198809
期刊: APPLIED PHYSICS LETTERS
Volume: 88
Issue: 17
結束頁: 
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