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dc.contributor.authorLin, Chia-Pinen_US
dc.contributor.authorTsui, Bing-Yueen_US
dc.contributor.authorHsieh, Chih-Mingen_US
dc.contributor.authorHuang, Chih-Fengen_US
dc.date.accessioned2014-12-08T15:16:48Z-
dc.date.available2014-12-08T15:16:48Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0584-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/12357-
dc.description.abstractLow threshold voltage CMOSFETs with NiSi fully silicided gate and Modified Schottky barrier source/drain junction were fabricated. Symmetric threshold voltage was obtained by implant-to-silicide technique. Lateral growth rate and thermal stability of NiSi on SiO2 were investigated. Single silicide and low temperature process make the proposed process very promising in sub-45nm technology nodes.en_US
dc.language.isoen_USen_US
dc.titleLow threshold voltage CMOSFETs with NiSi fully silicided gate and Modified Schottky barrier source/drain junctionen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Proceedings of Technical Papersen_US
dc.citation.spage172en_US
dc.citation.epage173en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247059300078-
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