標題: Ablation of Copper by a Single Ultrashort Laser Pulse
作者: Wang, S. Y.
Ren, Y. P.
Chang, K. P.
Cheng, C. W.
Chen, J. K.
Tzou, D. Y.
機械工程學系
Department of Mechanical Engineering
關鍵字: femtosecond laser;axisymmetric model;thermal ablation;copper film
公開日期: 1-六月-2014
摘要: Thermal ablation of copper films by a single Ti:Sapphire femtosecond laser pulse of wavelength 800 nm and duration 100 fs was investigated experimentally and theoretically. The laser experiments were performed; the ablation depth and crater profiles were measured for laser fluences up to 1037 J/cm(2). A comprehensive axisymmetric model, including a two-temperature model, phase change models for rapid melting and evaporation, and a phase explosion model for ejecting metastable liquid and vapor, was developed to simulate the laser material ablation process. The simulated ablation depths and crater profiles agree well with the experimental measurements.
URI: http://dx.doi.org/10.2961/jlmn.2014.02.0002
http://hdl.handle.net/11536/124013
ISSN: 1880-0688
DOI: 10.2961/jlmn.2014.02.0002
期刊: JOURNAL OF LASER MICRO NANOENGINEERING
起始頁: 88
結束頁: 92
顯示於類別:期刊論文