Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Tseng, Chien-Wei | en_US |
dc.contributor.author | Wang, Yu-Jiu | en_US |
dc.date.accessioned | 2015-07-21T08:29:06Z | - |
dc.date.available | 2015-07-21T08:29:06Z | - |
dc.date.issued | 2015-02-01 | en_US |
dc.identifier.issn | 1531-1309 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/LMWC.2014.2382682 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/124341 | - |
dc.description.abstract | This letter reports a fully integrated 60 GHz power amplifier (PA) implemented in TSMC 40 nm CMOS technology. This PA is based on a three-stage two-way differential topology with an output transformer-based power combining network. This topology improves layout symmetry and mitigates parasitic effects between different signal paths to increase overall efficiency. The use of parasitic coupling capacitors inside a vertically-coupled transformer can increase impedance transformation ratio. This PA achieves 20.3 dB power gain, 19.6 dBm output power with 18.3% peak PAE, and 12 GHz bandwidth. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Class-A | en_US |
dc.subject | cMOS technology | en_US |
dc.subject | power amplifier (PA) | en_US |
dc.subject | power combining | en_US |
dc.title | A 60 GHz 19.6 dBm Power Amplifier With 18.3% PAE in 40 nm CMOS | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/LMWC.2014.2382682 | en_US |
dc.identifier.journal | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | en_US |
dc.citation.volume | 25 | en_US |
dc.citation.spage | 121 | en_US |
dc.citation.epage | 123 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000349778300017 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Articles |