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dc.contributor.authorFu, Yu-Minen_US
dc.contributor.authorLiang, Yen R.en_US
dc.contributor.authorCheng, Yu-Tingen_US
dc.contributor.authorWu, Pu-Weien_US
dc.date.accessioned2015-07-21T08:29:25Z-
dc.date.available2015-07-21T08:29:25Z-
dc.date.issued2015-04-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2015.2401599en_US
dc.identifier.urihttp://hdl.handle.net/11536/124475-
dc.description.abstractIn this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 mu m and resistivities of similar to 9.8 mu Omega . cm on a flexible polyimide substrate via thermal sintering at 300 degrees C for 30 min. In addition, a printed interdigitated capacitor with an electrode line width and spacing of 10 mu m and a printed spiral square inductor with a 10-mu m line width and 5-mu m spacing in an area of 1 mm(2) have been successfully demonstrated with an area capacitance and inductance of 0.43 pF/mm(2) at 10 KHz and 1.054 mu H/mm(2) up to 100 KHz, respectively, which are the orders of magnitude performance improvement in comparison with the contemporary inkjet-printed capacitors and inductors. Owing to the significant reduction of energy demand in processing tools and waste generation in processing materials, the results have revealed that the CPLoP process can facilitate the advancement of printing manufacture technology for microelectronics applications.en_US
dc.language.isoen_USen_US
dc.subjectFlexible electronicsen_US
dc.subjectflexible inkjet printingen_US
dc.subjectinductoren_US
dc.subjectprinted microsystemsen_US
dc.titleA Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2015.2401599en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume62en_US
dc.citation.spage1248en_US
dc.citation.epage1254en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000351753900026en_US
dc.citation.woscount0en_US
Appears in Collections:Articles