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dc.contributor.authorChen, Kuan-Nengen_US
dc.contributor.authorTu, King-Ningen_US
dc.date.accessioned2015-07-21T08:28:39Z-
dc.date.available2015-07-21T08:28:39Z-
dc.date.issued2015-03-01en_US
dc.identifier.issn0883-7694en_US
dc.identifier.urihttp://dx.doi.org/10.1557/mrs.2015.8en_US
dc.identifier.urihttp://hdl.handle.net/11536/124548-
dc.description.abstractIn the present era of big data and the Internet of things (the interconnection of computing devices in the Internet infrastructure), the fabrication of mobile and other electronic devices by three-dimensional integrated circuits (3D ICs) is receiving wide attention. The concept of using 3D ICs to extend the limit of Moore\'s Law of two-dimensional ICs, by combining chip technology and packaging technology, has existed for more than 10 years. However, we still do not mass produce 3D IC devices due to low yield and reliability, as well as high cost. Most problems are caused by materials selection and integration at the small scale. This issue offers a review of 3D ICs and emphasizes the materials challenges of this new technology.en_US
dc.language.isoen_USen_US
dc.titleMaterials challenges in three-dimensional integrated circuitsen_US
dc.typeArticleen_US
dc.identifier.doi10.1557/mrs.2015.8en_US
dc.identifier.journalMRS BULLETINen_US
dc.citation.volume40en_US
dc.citation.spage219en_US
dc.citation.epage222en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000351157100015en_US
dc.citation.woscount0en_US
Appears in Collections:Articles