标题: | Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu |
作者: | Liu, Chien-Min Lin, Han-Wen Huang, Yi-Sa Chu, Yi-Cheng Chen, Chih Lyu, Dian-Rong Chen, Kuan-Neng Tu, King-Ning 材料科学与工程学系 电子工程学系及电子研究所 Department of Materials Science and Engineering Department of Electronics Engineering and Institute of Electronics |
公开日期: | 12-五月-2015 |
摘要: | Direct Cu-to-Cu bonding was achieved at temperatures of 150-250 degrees C using a compressive stress of 100 psi (0.69 MPa) held for 10-60 min at 10(-3) torr. The key controlling parameter for direct bonding is rapid surface diffusion on (111) surface of Cu. Instead of using (111) oriented single crystal of Cu, oriented (111) texture of extremely high degree, exceeding 90%, was fabricated using the oriented nano-twin Cu. The bonded interface between two (111) surfaces forms a twist-type grain boundary. If the grain boundary has a low angle, it has a hexagonal network of screw dislocations. Such network image was obtained by plan-view transmission electron microscopy. A simple kinetic model of surface creep is presented; and the calculated and measured time of bonding is in reasonable agreement. |
URI: | http://dx.doi.org/10.1038/srep09734 http://hdl.handle.net/11536/124642 |
ISSN: | 2045-2322 |
DOI: | 10.1038/srep09734 |
期刊: | SCIENTIFIC REPORTS |
Volume: | 5 |
起始页: | 0 |
结束页: | 0 |
显示于类别: | Articles |
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