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dc.contributor.authorHong, Yi-Siangen_US
dc.contributor.authorChen, Jui-Yuanen_US
dc.contributor.authorHuang, Chun-Weien_US
dc.contributor.authorChiu, Chung-Huaen_US
dc.contributor.authorHuang, Yu-Tingen_US
dc.contributor.authorHuang, Ting Kaien_US
dc.contributor.authorHe, Ruo Shiuanen_US
dc.contributor.authorWu, Wen-Weien_US
dc.date.accessioned2015-07-21T08:29:34Z-
dc.date.available2015-07-21T08:29:34Z-
dc.date.issued2015-04-27en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4919102en_US
dc.identifier.urihttp://hdl.handle.net/11536/124667-
dc.description.abstractRecently, the mechanism of resistive random access memory (RRAM) has been partly clarified and determined to be controlled by the forming and erasing of conducting filaments (CF). However, the size of the CF may restrict the application and development as devices are scaled down. In this work, we synthesized CuO nanowires (NW) (similar to 150 nm in diameter) to fabricate a CuO NW RRAM nanodevice that was much smaller than the filament (similar to 2 mu m) observed in a bulk CuO RRAM device in a previous study. HRTEM indicated that the Cu2O phase was generated after operation, which demonstrated that the filament could be minimize to as small as 3.8 nm when the device is scaled down. In addition, energy dispersive spectroscopy (EDS) and electron energy loss spectroscopy (EELS) show the resistive switching of the dielectric layer resulted from the aggregated oxygen vacancies, which also match with the I-V fitting results. Those results not only verify the switching mechanism of CuO RRAM but also show RRAM has the potential to shrink in size, which will be beneficial to the practical application of RRAM devices. (C) 2015 AIP Publishing LLC.en_US
dc.language.isoen_USen_US
dc.titleSingle-crystalline CuO nanowires for resistive random access memory applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4919102en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume106en_US
dc.citation.issue17en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000353839100046en_US
dc.citation.woscount0en_US
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