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dc.contributor.authorChen, Yi-Enen_US
dc.contributor.authorTsai, Tu-Hsiungen_US
dc.contributor.authorChen, Shi-Haoen_US
dc.contributor.authorChen, Hung-Mingen_US
dc.date.accessioned2015-07-21T08:31:18Z-
dc.date.available2015-07-21T08:31:18Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-3-9815370-2-4en_US
dc.identifier.issn1530-1591en_US
dc.identifier.urihttp://hdl.handle.net/11536/125142-
dc.description.abstractIn designing reliable power distribution networks (PDN) for power integrity (PI), it is essential to stabilize voltage supply to devices on chip. We usually employ decoupling capacitor (decap) to suppress the noise generated by the switching of devices. There have been numerous prior works on how to select/insert decaps in chip, package, or board to maintain PI, however optimal decap selection is usually not applicable due to design budget and manufacturability. Moreover, design cost is seldom touched or mentioned. In this research, we propose an efficient methodology "PDC-PSO" to automatically optimizing the selection of available decaps. This algorithm not only takes advantage of particle swarm optimization (PSO) to stochastically search the design space, but takes the most effective range of decaps into consideration to outperform the basic PSO. We apply this to three real package designs and the results show that, compared to the original decap selection by rules of thumb, our approach could shorten the design period and we have better combination of decaps at the same or lower cost. In addition, our methodology can also consider package-board co-design in optimizing different operation frequencies.en_US
dc.language.isoen_USen_US
dc.titleCost-Effective Decap Selection for Beyond Die Power Integrityen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION (DATE)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000354965500046en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper