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dc.contributor.authorChen, YMen_US
dc.contributor.authorTu, GCen_US
dc.contributor.authorWang, YLen_US
dc.date.accessioned2014-12-08T15:17:19Z-
dc.date.available2014-12-08T15:17:19Z-
dc.date.issued2006-03-01en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2005.07.075en_US
dc.identifier.urihttp://hdl.handle.net/11536/12589-
dc.description.abstractOxide-mediated epitaxy (OME) is a highly promising means of forming epitaxial CoSi2. In this work, various chemical treatments were applied to grow chemical oxides on heavily doped Si substrates and narrow width active region. The effects of the treatment on the OME performance were investigated. Both the thickness and the quality of the oxide varied with the chemicals and dopants, resulting in various levels of junction leakage current. The junction leakage current was minimized by choosing the most favorable chemical treatment and optimizing the annealing temperature. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectoxide-mediated epitaxyen_US
dc.subjectsilicideen_US
dc.subjectjunction leakageen_US
dc.titleOxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active regionen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.tsf.2005.07.075en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume498en_US
dc.citation.issue1-2en_US
dc.citation.spage90en_US
dc.citation.epage93en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000235270500018-
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