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dc.contributor.authorGuo, JCen_US
dc.contributor.authorLin, YMen_US
dc.date.accessioned2014-12-08T15:17:27Z-
dc.date.available2014-12-08T15:17:27Z-
dc.date.issued2006-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2005.862699en_US
dc.identifier.urihttp://hdl.handle.net/11536/12652-
dc.description.abstractA new equivalent circuit method is proposed in this paper to de-embed the lossy substrate and lossy pads' parasitics; from the measured RF noise of multifinger MOSFETs with aggressive gate length scaling down to 80 run. A new RLC network model is subsequently developed to simulate the lossy substrate and lossy pad effect. Good agreement has been realized between the measurement and simulation in terms of S-parameters and four noise parameters, NFmin,, (minimum noise figure), R, (noise resistance), Re(Y-sopt), and Im(Y-sopt) for the sub-100-nm RF nMOS devices. The intrinsic NFmin extracted by the new de-embedding method reveal that NFmin at 10 GHz can be suppressed to below 0.8 dB for the 80-nm nMOS attributed to the advancement of f(T) to 100-GHz level and the effectively reduced gate resistance by multifinger structure.en_US
dc.language.isoen_USen_US
dc.subjectde-embeddingen_US
dc.subjectnoiseen_US
dc.subjectpaden_US
dc.subjectRF CMOSen_US
dc.subjectsubstrateen_US
dc.titleA new lossy substrate de-embedding method for sub-100 nm RF CMOS noise extraction and modelingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2005.862699en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume53en_US
dc.citation.issue2en_US
dc.citation.spage339en_US
dc.citation.epage347en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000234850600021-
dc.citation.woscount20-
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