玻璃V溝微結構熱壓成形之有限元素分析

Abstract

玻璃V型微結構溝槽利用模造成形來取代傳統切削技術之優勢為成本節省、量產快速、製程簡單等，因此本研究中將嘗試以模造成形製作光纖玻璃基板所需之V溝結構。而由於始終無法製造出尺寸正確的V溝結構模具，所以在研究後期便以目前現有的模具探討玻璃模造的填充性以及探討模擬與實驗之間可靠性的研究。 在本研究中，先以數種實驗取得玻璃K-PSK100的熱膨脹係數、結構鬆弛、應力鬆弛的材料性質，再利用實驗室現有的有限元素模擬技術，以量測結果建立微結構模具外型，確立了有限元素模擬的精度；接著再以模擬玻璃外型對比實驗玻璃外型，確認了凹痕模具與超音波輔助對玻璃V溝轉印性的重要性。另外，從有限元素模擬中也可預測殘留應力，考慮何處有集中應力容易對產品產生破壞等問題。

There are two ways to make V-groove microstructure on the glass, hot embossing and traditional cutting. Compare these two technique methods, embossing process has the advantage of cost effective, mass production and process simplification. Therefore, the method of hot embossing will be used to make V-groove microstructure on the glass for positioning glass fiber in this research. The filling capability of V-groove glass embossing from manufactured stainless mold will the investigated by using finite element simulation and conducting molding experiments. First, the thermal expansion coefficient, structural relaxation and the stress relaxation of K-PSK100 glass will obtained experimentally. The glass properties will than be input into the MARC software with a Newtonian flow subroutine already established in our laboratory to simulate the process of V-groove hot embossing on glass. Comparison between the result of simulation and hot embossing experiments reveals that, both the impression lower mold and ultrasonic-vibration can increase the filling capability of V-groove structure. The finite element simulation also verified that, the relaxation properties of glass will not affect the final profile of the structures, but will dominate the residual stress distribution which is closely related to the possible fracture of glass product.