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dc.contributor.authorTai, YHen_US
dc.contributor.authorHuang, SCen_US
dc.contributor.authorChiu, HLen_US
dc.date.accessioned2014-12-08T15:17:35Z-
dc.date.available2014-12-08T15:17:35Z-
dc.date.issued2006en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/12757-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2191007en_US
dc.description.abstractThe degradation of poly-Si thin film transistors (TFTs) under self-heating stress was investigated via the capacitance between the source and the gate (C-GS), and that between the drain and the gate (C-GD). Consequently, the normalized C-GS and C-GD after stress positively shift 2 V for the gate voltage near flat band voltage. In addition, C-GS raises about 40% for the lower gate voltage, while C-GD raises only about 10%. With simulation results, it is found that the self-heating effect creates interface states near the source region and the deep states near drain, resulting in the different inclines of the of C-GS and C-GD curves.en_US
dc.language.isoen_USen_US
dc.titleDegradation of capacitance-voltage characteristics induced by self-heating effect in poly-si TFTsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2191007en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume9en_US
dc.citation.issue6en_US
dc.citation.spageG208en_US
dc.citation.epageG210en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000236679500027-
dc.citation.woscount7-
Appears in Collections:Articles