完整後設資料紀錄
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dc.contributor.authorHou, Yi-Chengen_US
dc.contributor.authorHuang, Mei-Jiauen_US
dc.contributor.authorChuang, Pi-Yuehen_US
dc.contributor.authorChang, Hsiu-Chengen_US
dc.contributor.authorChen, Chun-Huaen_US
dc.date.accessioned2015-12-02T02:59:05Z-
dc.date.available2015-12-02T02:59:05Z-
dc.date.issued2015-08-01en_US
dc.identifier.issn0017-9310en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.ijheatmasstransfer.2015.04.040en_US
dc.identifier.urihttp://hdl.handle.net/11536/127843-
dc.description.abstractThis research aims at understanding the heat transfer phenomenon in the Bi2Te3 nanoprism-assembled films. For obtaining the associated effective thermal conductivity, the effective-medium-approximation (EMA) models existing in literature were examined and properly modified for prediction and Monte-Carlo numerical experiments based on unstructured grids were performed for confirmation. Cross-plane and in-plane thermal conductivities were both explored. For model predictions, the characteristic grain size of the nanoprisms is defined as either the phonon mean free path purely due to the grain boundary scattering (i.e. excluding the intrinsic scattering) or the averaged hydraulic diameter. A combination of a non-dilute 2D EMA model with the triple bond percolation theory turns out to be the best model for predicting the in-plane thermal conductivity. On the other hand, the evaluation of the cross-plane thermal conductivity by treating the nanoprisms as thermal conductors connected in parallel is satisfactory. The investigation shows that in addition to porosity, the scattering at the grain boundaries plays a dominant role in reducing the heat transfer in the direction perpendicular to the boundaries: the in-plane thermal conductivity is therefore much smaller than the cross-plane one. (C) 2015 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectBismuth telluride nanoprism-assembled filmsen_US
dc.subjectLattice thermal conductivityen_US
dc.subjectMonte-Carlo simulationen_US
dc.subjectEffective medium approximationen_US
dc.titleNumerical and model predictions of the thermal conductivity of bismuth telluride nanoprism-assembled filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.ijheatmasstransfer.2015.04.040en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFERen_US
dc.citation.volume87en_US
dc.citation.spage536en_US
dc.citation.epage543en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000356753900053en_US
dc.citation.woscount1en_US
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