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dc.contributor.authorTao, Nick G. M.en_US
dc.contributor.authorLin, Bo-Rongen_US
dc.contributor.authorLee, Chien-Pingen_US
dc.contributor.authorHenderson, Timen_US
dc.contributor.authorLin, Barry J. F.en_US
dc.date.accessioned2015-12-02T02:59:20Z-
dc.date.available2015-12-02T02:59:20Z-
dc.date.issued2015-06-01en_US
dc.identifier.issn1759-0787en_US
dc.identifier.urihttp://dx.doi.org/10.1017/S1759078715000495en_US
dc.identifier.urihttp://hdl.handle.net/11536/128073-
dc.description.abstractThe safe operating area (SOA) of InGaP/GaAs heterojunction bipolar transistors has been studied using two-dimensional Technology Computer-Aided Design (TCAD) tool. Comprehensive physical models, including hydrodynamic transport-based impact ionization and self-heating models were implemented. The simulations for two DC modes (constant I-b and V-b modes) captured all the SOA features observed in measurements and some failure mechanisms were revealed for the first time by TCAD simulations. The simulated results are also in agreement with analytical modeling. The simulation not only gives us insight to the detailed failure mechanisms, but also provides guidance for the design of devices with better ruggedness and improved SOA performances.en_US
dc.language.isoen_USen_US
dc.subjectSimulationen_US
dc.subjectHBTen_US
dc.subjectSafe operating areaen_US
dc.subjectTCADen_US
dc.titleStudy on mechanisms of InGaP/GaAs HBT safe operating area using TCAD simulationen_US
dc.typeArticleen_US
dc.identifier.doi10.1017/S1759078715000495en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIESen_US
dc.citation.issue3-4en_US
dc.citation.spage279en_US
dc.citation.epage285en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000358325700009en_US
dc.citation.woscount0en_US
Appears in Collections:Articles