Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solder

Abstract

High thermal resistance of LED die-attached (DA) material degraded LED\'s performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305. (C) 2015 The Electrochemical Society. All rights reserved.