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dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorWu, Ming-Hungen_US
dc.contributor.authorChan, Chin-Wenen_US
dc.contributor.authorLyu, Rong-Jheen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.date.accessioned2015-12-02T02:59:25Z-
dc.date.available2015-12-02T02:59:25Z-
dc.date.issued2015-08-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.7567/JJAP.54.081102en_US
dc.identifier.urihttp://hdl.handle.net/11536/128162-
dc.description.abstractIn this study we cleverly employ the film profile engineering (FPE) concept to fabricate amorphous InGaZnO (a-IGZO) thin-film transistor (TFT)-based inverters with a resistor-or transistor-load. In the fabrication the profiles of major thin films in both load and drive devices can be properly tailored with designed channel dimensions and deposition conditions. Although the inverter with a resistor-load is simpler in structure and fabrication, the switching performance is found to be restricted by the passive load component. The performance can be greatly promoted as a depletion-mode transistor-load is used instead. Full-swing operation is demonstrated for the inverter with a voltage gain of 28 recorded at an operation voltage (V-DD) of 5V. (C) 2015 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleNovel InGaZnO inverters utilizing film profile engineeringen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/JJAP.54.081102en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume54en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000360165000006en_US
dc.citation.woscount0en_US
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