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dc.contributor.authorLiao, Chien-Huien_US
dc.contributor.authorWen, Charles H. -P.en_US
dc.date.accessioned2015-12-02T02:59:38Z-
dc.date.available2015-12-02T02:59:38Z-
dc.date.issued2015-11-01en_US
dc.identifier.issn1063-8210en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TVLSI.2014.2360802en_US
dc.identifier.urihttp://hdl.handle.net/11536/128386-
dc.description.abstractThermal-constrained task scheduler for throughput optimization on 3-D multicore processors (3-D MCPs) has been studied extensively. However, these throughput-optimized strategies often ignore energy consumption and overuse thermal simulations. Therefore, in this brief, a new strategy named thermal-aware mapping and VoltagE scaling (TAMVES) is proposed to optimize throughput and energy consumption while satisfying thermal constraints (in terms of both peak temperature and temperature gradient) simultaneously. Layer-by-layer task-to-core mapping and thermal-and-energy-aware voltage scaling are incorporated in TAMVES to reduce peak temperature and temperature gradient without extensive thermal simulation. Furthermore, idle time slots are also utilized by voltage scaling for minimizing energy consumption. Our experimental results show that under thermal constraints, TAMVES outperforms a previous work (3-D Wave) by 35.30% averagely on throughput. In addition, TAMVES that features three-order faster speed under timing constraints outperforms 3-D Wave for saving 51.17% more energy and reducing 8.37% more peak temperature and 5.67% more temperature gradient. As a result, TAMVES has proven itself an effective task scheduler that optimizes throughput and energy on 3-D MCPs under thermal constraints.en_US
dc.language.isoen_USen_US
dc.subject3-D multicore processor (3-D MCP)en_US
dc.subjectdynamic voltage and frequency scaling (DVFS)en_US
dc.subjectenergyen_US
dc.subjecthot spoten_US
dc.subjecttask schedulingen_US
dc.subjecttemperature gradienten_US
dc.subjectthroughputen_US
dc.titleThermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimizationen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TVLSI.2014.2360802en_US
dc.identifier.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSen_US
dc.citation.volume23en_US
dc.citation.issue11en_US
dc.citation.spage2719en_US
dc.citation.epage2723en_US
dc.contributor.department電機資訊學士班zh_TW
dc.contributor.departmentUndergraduate Honors Program of Electrical Engineering and Computer Scienceen_US
dc.identifier.wosnumberWOS:000364209000038en_US
dc.citation.woscount0en_US
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