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dc.contributor.authorCheng, Tung-Huaen_US
dc.contributor.authorTseng, Ching-Huanen_US
dc.contributor.authorHung, Ching-Huaen_US
dc.date.accessioned2014-12-08T15:17:41Z-
dc.date.available2014-12-08T15:17:41Z-
dc.date.issued2006en_US
dc.identifier.issn0169-4243en_US
dc.identifier.urihttp://hdl.handle.net/11536/12839-
dc.identifier.urihttp://dx.doi.org/10.1163/156856106779024463en_US
dc.description.abstractIn this study, a concentrated force is applied to both adherends bonded by an adhesive under pin-pin boundary conditions. First a mathematical model is derived with governing equations and boundary conditions. These complicated, and analytically problematic, coupled equations are solved numerically using symbolic manipulation and singular value decomposition (SVD). Also discussed are the effects of major factors, including the relative thickness of adherends, joint length and the action point of the concentrated force on the peel and shear stresses in the adhesive layer. This study identifies the conditions under which the upper adherend without breakage can be fully separated from the lower adherend. Particularly, it is found that the thickness of the lower adherend should be greater than ten times that of the adhesive layer but less than one-third that of the upper adherend, the adhesive layer should be relatively thin (h(a) <= 0.01 mm), and the adhesive joint should be relatively short (thickness to length ratio gamma(1) >= 0.08).en_US
dc.language.isoen_USen_US
dc.subjectcoupled equationsen_US
dc.subjectadhesive jointen_US
dc.subjectsymbolic manipulationen_US
dc.subjectsingular value decompositionen_US
dc.subjectpeel stressen_US
dc.subjectshear stressen_US
dc.titleAnalysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical methoden_US
dc.typeArticleen_US
dc.identifier.doi10.1163/156856106779024463en_US
dc.identifier.journalJOURNAL OF ADHESION SCIENCE AND TECHNOLOGYen_US
dc.citation.volume20en_US
dc.citation.issue15en_US
dc.citation.spage1669en_US
dc.citation.epage1692en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000243355700002-
dc.citation.woscount7-
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