完整後設資料紀錄
DC 欄位語言
dc.contributor.authorTsui, Bing-Yueen_US
dc.contributor.authorTseng, Hsuan-Tzuen_US
dc.date.accessioned2015-12-02T03:00:50Z-
dc.date.available2015-12-02T03:00:50Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-2192-8en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/128482-
dc.description.abstractThis work evaluates the accuracy of the specific contact resistance extraction by the cross-bridge Kelvin resistor (CBKR) structure and the self-aligned transmission line method (mTLM) structure considering three-dimensional effect. The mTLM structure is more accurate than the CBKR structure in theory but more sensitive to process variation. The sensitivity to process variation could be suppressed by averaging large amount data. Nevertheless, the recessed contact interface would underestimate the true specific contact resistance and would cause complicated extraction problem for both test structures as the contact resistivity becomes less than 10(-8) ohm-cm(2).en_US
dc.language.isoen_USen_US
dc.subjectspecific contact resistanceen_US
dc.subjectcontact resistivityen_US
dc.subjectcross-bridge Kelvin resistoren_US
dc.subjecttransmission line methoden_US
dc.titleEvaluation of Ultra-low Specific Contact Resistance Extraction by Cross-Bridge Kelvin Resistor Structure and Transmission Line Method Structureen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS)en_US
dc.citation.spage58en_US
dc.citation.epage63en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000356419800010en_US
dc.citation.woscount0en_US
顯示於類別:會議論文