Title: A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array
Authors: Chou, Lei-Chun
Lee, Shih-Wei
Cheng, Chuan-An
Huang, Po-Tsang
Chang, Chih-Wei
Chiang, Cheng-Hao
Wu, Shang-Lin
Chuang, Ching-Te
Chiou, Jin-Chern
Hwang, Wei
Wu, Chung-Hsi
Chen, Kuo-Hua
Chiu, Chi-Tsung
Tong, Ho-Ming
Chen, Kuan-Neng
交大名義發表
National Chiao Tung University
Keywords: TSV;CMOS MEMS;Bio-Signal Probe
Issue Date: 1-Jan-2014
Abstract: Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.
URI: http://hdl.handle.net/11536/128528
ISBN: 978-1-4799-2217-8
ISSN: 
Journal: PROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)
Appears in Collections:Conferences Paper