Full metadata record
DC FieldValueLanguage
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorChen, Yin-Nienen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2015-12-02T03:00:54Z-
dc.date.available2015-12-02T03:00:54Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-2217-8en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/128529-
dc.description.abstractIn this work, we investigate the impact of interlayer coupling on monolithic 3D 6T/8T SRAM cells with various layouts and tier combinations. Our results indicate that for 3D 6T SRAM cell with NFET in top layer, aligning upper-tier pull-down NFET with bottom-tier pull-up PFET enables better cell stability. For monolithic 3D 8T cell, an area-efficient 4N4P design is evaluated with optimized two-tier layout to enhance cell performance. We find that stacking NFET layer over the PFET tier results in larger design margins for SRAM cell stability and performance.en_US
dc.language.isoen_USen_US
dc.titleStability/Performance Assessment of Monolithic 3D 6T/ST SRAM Cells Considering Transistor-Level Interlayer Couplingen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000358865800041en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper