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dc.contributor.authorLiu, SHen_US
dc.contributor.authorShieh, JMen_US
dc.contributor.authorChen, Cen_US
dc.contributor.authorHensen, Ken_US
dc.contributor.authorCheng, SSen_US
dc.date.accessioned2014-12-08T15:17:42Z-
dc.date.available2014-12-08T15:17:42Z-
dc.date.issued2006en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/12852-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2193348en_US
dc.description.abstractThis study explores how the dissolution of damascene Cu depends on accelerators of organic acids in alcohol-containing H3PO4 electropolishing electrolytes. Four two-additive electrolytes that contain different accelerators, acetic, citric, citrazinic, and benzoic acids, are evaluated. At the bottom of damascene features, an esterification reaction between alcohols and organic acids efficiently forms a highly resistive layer and reduces the acidity of the solution. Accordingly, outside the damascene features, the rate of removal of Cu is dominated by the acidity of electrolytes but, inside the features, it is also determined by the resistance of the viscous layer. For a weak acidic additive, acetic acid, an extremely high additive concentration is introduced to sustain the moderate acidity of the solution to initiate intense esterification. Therefore, acetic-acid-based two-additive electrolytes exhibit excellent Cu planarization capability. (C) 2006 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleRoles of additives in damascene copper electropolishingen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2193348en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume153en_US
dc.citation.issue6en_US
dc.citation.spageC428en_US
dc.citation.epageC433en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000237229300058-
dc.citation.woscount4-
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