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dc.contributor.authorTsui, Bing-Yueen_US
dc.contributor.authorChang, Ko-Chinen_US
dc.contributor.authorShew, Bor-Yuanen_US
dc.contributor.authorLee, Heng-Yuanen_US
dc.contributor.authorTsai, Ming-Jinnen_US
dc.date.accessioned2015-12-02T03:00:54Z-
dc.date.available2015-12-02T03:00:54Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-2217-8en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/128532-
dc.description.abstractRadiation hardness of HfO2-based resistive random-access memory (RRAM) is investigated using extreme ultra-violet (EUV) and X-ray as radiation source. The low-resistance state (LRS) is immune to irradiation, but temporary change of the high-resistance state (HRS) and endurance degradation could be observed at high total irradiation dose (TID). A physical model is proposed to explain these observations. It is concluded that the HfO2-based RRAM can be operated in high radiation environment, and EUV can be use to fabricate high-density RRAM array.en_US
dc.language.isoen_USen_US
dc.titleInvestigation of Radiation Hardness of HfO2 Resistive Random Access Memoryen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000358865800036en_US
dc.citation.woscount0en_US
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