完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, Bo-Rong | en_US |
dc.contributor.author | Tao, Nick G. M. | en_US |
dc.contributor.author | Lee, Chien-Ping | en_US |
dc.contributor.author | Henderson, Tim | en_US |
dc.contributor.author | Lin, Barry J. F. | en_US |
dc.date.accessioned | 2015-12-02T03:00:57Z | - |
dc.date.available | 2015-12-02T03:00:57Z | - |
dc.date.issued | 2014-01-01 | en_US |
dc.identifier.isbn | 978-2-87487-036-1 | en_US |
dc.identifier.issn | en_US | |
dc.identifier.uri | http://hdl.handle.net/11536/128584 | - |
dc.description.abstract | The safe operating area (SOA) of InGaP/GaAs heterojunction bipolar transistors (HBT) has been studied using two-dimensional (2D) Technology Computer-Aided Design (TCAD) tool. The hydrodynamic transport based impact ionization and self-heating models were implemented. The DC simulation result shows two distinct SOA boundary regimes corresponding to different dominant mechanisms, which is in good agreement with analytical modeling and experimental results. The simulation not only gives us insight to the detailed failure mechanisms but also provides guidance for the design of devices with better ruggedness and improved SOA performances. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | HBT | en_US |
dc.subject | safe operating area | en_US |
dc.subject | TCAD | en_US |
dc.subject | simulation | en_US |
dc.title | 2D Numerical Simulation for InGaP/GaAs HBT Safe Operating Area | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2014 9TH EUROPEAN MICROWAVE INTEGRATED CIRCUIT CONFERENCE (EUMIC) | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000361635500001 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 會議論文 |