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dc.contributor.authorTsai, KCen_US
dc.contributor.authorWu, WFen_US
dc.contributor.authorChao, CGen_US
dc.contributor.authorKuan, CPen_US
dc.date.accessioned2014-12-08T15:17:43Z-
dc.date.available2014-12-08T15:17:43Z-
dc.date.issued2006en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/12862-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2185283en_US
dc.description.abstractThe properties of tantalum oxide (Ta2O5) metal-insulator-metal (MIM) capacitors with Al/Ta/Cu/Ta bottom electrodes were investigated. An ultrathin Al film successfully suppresses oxygen diffusion in the Ta2O5 MIM capacitor with the Cu-based electrode. The electrical characteristics and reliability of Ta2O5 MIM capacitors are improved by addition of ultrathin Al films. Ta2O5 MIM capacitors have low leakage current density (1 nA/cm(2) at 1 MV/cm) and high breakdown field (5.2 MV/cm at 10(-6) A/cm(2)). The decrease in leakage current is attributed to the formation of a dense and uniform Al2O3 layer, which has self-protection property and stops further oxygen diffusion into the tantalum contact. The dominant conduction mechanism of leakage current is the Poole-Frenkel effect at electric fields above 1.5 MV/cm. (c) 2006 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleHigh-reliability Ta2O5 metal-insulator-metal capacitors with Cu-based electrodesen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2185283en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume153en_US
dc.citation.issue5en_US
dc.citation.spageG492en_US
dc.citation.epageG497en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000236516000078-
dc.citation.woscount11-
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