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dc.contributor.authorChien Chao-Hsinen_US
dc.contributor.authorChung Cheng-Tingen_US
dc.contributor.authorChen Che-Weien_US
dc.date.accessioned2015-12-04T07:03:15Z-
dc.date.available2015-12-04T07:03:15Z-
dc.date.issued2015-10-08en_US
dc.identifier.govdocH01L029/78zh_TW
dc.identifier.govdocH01L029/45zh_TW
dc.identifier.govdocH01L029/51zh_TW
dc.identifier.govdocH01L029/49zh_TW
dc.identifier.govdocH01L021/285zh_TW
dc.identifier.govdocH01L029/16zh_TW
dc.identifier.govdocH01L029/417zh_TW
dc.identifier.govdocH01L029/423zh_TW
dc.identifier.govdocH01L021/02zh_TW
dc.identifier.govdocH01L029/66zh_TW
dc.identifier.govdocH01L029/06zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/128695-
dc.description.abstractA semiconductor device and methods of formation are provided. The semiconductor device includes a first metal alloy over a first active region of a fin and a second metal alloy over a second active region of the fin. A conductive layer is over a channel region of the fin. A semiconductive layer is over the conductive layer. The conductive layer over the channel region suppresses current leakage and the semiconductive layer over the conductive layer reduces electro flux from a source to a drain, as compared to a channel region that does not have such a conductive layer or a semiconductive layer over a conductive layer. The semiconductor device having the first metal alloy as at least one of the source or drain requires a lower activation temperature than a semiconductor device that does not have a metal alloy as a source or a drain.zh_TW
dc.language.isozh_TWen_US
dc.titleSEMICONDUCTOR DEVICE AND FORMATION THEREOFzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20150287819zh_TW
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