Title: 單晶銅、其製備方法及包含其之基板
Authors: 陳智
杜經寧
呂佳凌
Issue Date: 11-Nov-2015
Abstract: 一種單晶銅,該單晶銅具有[100]方向,且體積係介於0.1~4.0×106 μm3 間以及厚度係介於0.1~50μm。
Gov't Doc #: C25D003/38
C30B029/02
URI: http://hdl.handle.net/11536/128801
Patent Country: TWN
Patent Number: I507569
Appears in Collections:Patents


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