標題: Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures
作者: Chiu, Wei-Lan
Liu, Chien-Min
Haung, Yi-Sa
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Intermetallic alloys and compounds;Metallurgy;Diffusion
公開日期: 1-Feb-2016
摘要: Transient liquid reactions in Cu/Sn/Cu sandwich structures during various stages were conducted at 340 degrees C. In the early stages of the reaction, Cu atoms dissolved into the molten Sn through the valleys between the scallop-like Cu6Sn5 intermetallic compounds (IMCs). When the Sn layer was almost consumed, formation of plate-like Sn channels in Cu6Sn5 IMCs was observed at later stages of the reaction. In addition, plate-like Cu6Sn5 channels formed in Cu3Sn IMCs because Cu atoms diffused faster in Cu6Sn5 than in Cu3Sn IMCs. These channels serve as fast diffusion paths for Cu to react with the remaining Sn. Hence, the growth kinetics at later stages are quite different from those at the beginning stages. (C) 2015 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.matlet.2015.10.056
http://hdl.handle.net/11536/129490
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2015.10.056
期刊: MATERIALS LETTERS
Volume: 164
Appears in Collections:Articles