標題: | Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization |
作者: | Chiu, Wei-Lan Liu, Chien-Min Haung, Yi-Sa Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 28-四月-2014 |
摘要: | Cu3Sn intermetallic compounds (IMCs) are more resistant to fracture than solders. In addition, the Cu3Sn IMCs are more conductive than the solders. In this study, we manufactured Cu3Sn IMCs to serve as a joint using electroplated nanotwinned Cu as a metallization layer to react with pure Sn at 260 degrees C and 340 degrees C. The results show that there were almost no Kirkendall voids generated inside the Cu3Sn layer. In addition, the kinetics of the Cu3Sn growth was analyzed to predict the time needed to form the Cu3Sn joint. (C) 2014 AIP Publishing LLC. |
URI: | http://dx.doi.org/10.1063/1.4874608 http://hdl.handle.net/11536/24471 |
ISSN: | 0003-6951 |
DOI: | 10.1063/1.4874608 |
期刊: | APPLIED PHYSICS LETTERS |
Volume: | 104 |
Issue: | 17 |
結束頁: | |
顯示於類別: | 期刊論文 |