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dc.contributor.authorLin, Yu-Hseinen_US
dc.contributor.authorLi, Jyun-Hanen_US
dc.contributor.authorYou, Hsin-Chiangen_US
dc.contributor.authorHong, Jin-Shien_US
dc.contributor.authorTsai, Wan-Tingen_US
dc.contributor.authorChen, Hung-Weien_US
dc.date.accessioned2016-03-28T00:05:44Z-
dc.date.available2016-03-28T00:05:44Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-5277-9en_US
dc.identifier.issnen_US
dc.identifier.urihttp://dx.doi.org/10.1109/IS3C.2014.128en_US
dc.identifier.urihttp://hdl.handle.net/11536/129803-
dc.description.abstractThis paper study a novel nonvolatile memory by using HfO2 trapping layer on epi-SiGe (Ge: 15%) channel. Because SiGe has a smaller bandgap than that of silicon, it can increases the electron/hole injection and enhances the program/erase speed. This study compares the characteristics of HfO2 memories with different tunnel oxynitride thicknesses on epi-SiGe substrate. The results show that the nonvolatile memory has superior characteristics in terms of considerably large memory window, high speed program/erase, long retention time, good endurance for future low power applications.en_US
dc.language.isoen_USen_US
dc.subjectNonvolatile memoriesen_US
dc.subjectFlash memoryen_US
dc.subjectSiGe channelen_US
dc.subjectHafnium oxideen_US
dc.subjectTrapping Layeren_US
dc.titleHfO2 Trap Layer Nonvolatile Flash Memory on SiGe Channelen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/IS3C.2014.128en_US
dc.identifier.journal2014 INTERNATIONAL SYMPOSIUM ON COMPUTER, CONSUMER AND CONTROL (IS3C 2014)en_US
dc.citation.spage466en_US
dc.citation.epage469en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000366660900116en_US
dc.citation.woscount0en_US
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