發展超低溫銅接合與3DIC技術以實現40奈米與0.18微米異質整合平台及先進小尺寸石英震盪元件之研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳冠能	zh_TW
dc.contributor.author	CHEN KUAN-NENG	en_US
dc.date.accessioned	2016-03-28T08:17:43Z	-
dc.date.available	2016-03-28T08:17:43Z	-
dc.date.issued	2015	en_US
dc.identifier.govdoc	MOST103-2221-E009-173-MY3	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/130377	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=11275066&docId=456264	en_US
dc.description.sponsorship	科技部	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	發展超低溫銅接合與3DIC技術以實現40奈米與0.18微米異質整合平台及先進小尺寸石英震盪元件之研究	zh_TW
dc.title	Research and Development of Heterogenous 40-nm/0.18-um Technology Integration Platform and Advanced Small Crystal Resonator Device System Based on Ultra-Low-Temperature Cu Bonding Technology	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
Appears in Collections:	Research Plans