完整後設資料紀錄
DC 欄位語言
dc.contributor.authorLee, YJen_US
dc.contributor.authorKuo, HCen_US
dc.contributor.authorWang, SCen_US
dc.contributor.authorHsu, TCen_US
dc.contributor.authorHsieh, MHen_US
dc.contributor.authorJou, MJen_US
dc.contributor.authorLee, BJen_US
dc.date.accessioned2014-12-08T15:18:09Z-
dc.date.available2014-12-08T15:18:09Z-
dc.date.issued2005-11-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2005.858153en_US
dc.identifier.urihttp://hdl.handle.net/11536/13116-
dc.description.abstractAn n-side-up AlGaInP-based light-emitting diode (LED) with a triangle-like surface morphology was fabricated using the adhesive layer bonding technique, followed by wet etching to roughen the surface. The light output power of the roughened-surface LED was 1.6 times higher than that of a flat-surface LED at an injection current of 20 mA, i.e., a significant improvement attributed to the ability of the roughened surface to not only reduce the internal reflection between the rear mirror system and the semiconductor-air interface, but also to effectively scatter the light outside the LED device.en_US
dc.language.isoen_USen_US
dc.subjectAlGaInPen_US
dc.subjectlight-emitting diode (LED)en_US
dc.subjectsurface rougheningen_US
dc.titleIncreasing the extraction efficiency of AlGaInP LEDs via n-side surface rougheningen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2005.858153en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume17en_US
dc.citation.issue11en_US
dc.citation.spage2289en_US
dc.citation.epage2291en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000232898100016-
dc.citation.woscount33-
顯示於類別:期刊論文


文件中的檔案:

  1. 000232898100016.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。