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dc.contributor.authorYan, JKen_US
dc.contributor.authorChang, Len_US
dc.date.accessioned2014-12-08T15:18:10Z-
dc.date.available2014-12-08T15:18:10Z-
dc.date.issued2005-11-01en_US
dc.identifier.issn0925-9635en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.diamond.2005.09.019en_US
dc.identifier.urihttp://hdl.handle.net/11536/13126-
dc.description.abstractDiamond deposition on I x I cm 2 Si (100) substrates with bias was carried out by microwave plasma chemical vapor deposition (MPCVD). Distribution of deposited diamonds has been significantly improved in uniformity over all the Si substrate surface area by using a novel designed dome-shaped Mo anode. The deposits were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), and Raman analysis. SEM observations show that there is a high density of cone-like particles uniformly deposited on the surface of the substrate in short bias nucleation period. The average diameter, height and density of cone-like structure were increased with methane concentration in the bias stage. TEM reveals that the cone-like structure is actually composed of Si conic crystal covered with diamond. Between Si and diamond, a thin layer of cubic SiC is found in epitaxy with Si. Furthermore, for 3% CH4 concentration, the range of diameter of cone-like structure was about 2090 nm and the size of diamond was about 10-60 nm. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdiamonden_US
dc.subjectnucleationen_US
dc.subjectepitaxyen_US
dc.subjecttransmission electron microscopy (TEM)en_US
dc.titleMicrowave plasma chemical vapor deposition of cone-like structure of diamond/SiC/Si on Si (100)en_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.diamond.2005.09.019en_US
dc.identifier.journalDIAMOND AND RELATED MATERIALSen_US
dc.citation.volume14en_US
dc.citation.issue11-12en_US
dc.citation.spage1770en_US
dc.citation.epage1775en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000233983600008-
Appears in Collections:Conferences Paper


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