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dc.contributor.author邱碧秀zh_TW
dc.contributor.author楊聰仁zh_TW
dc.date.accessioned2016-12-20T03:57:06Z-
dc.date.available2016-12-20T03:57:06Z-
dc.date.issued1993en_US
dc.identifier.govdocNSC82-0404-E009-142 zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=45837&docId=6582en_US
dc.identifier.urihttp://hdl.handle.net/11536/132153-
dc.description.abstract zh_TW
dc.description.abstract en_US
dc.description.sponsorship行政院國家科學委員會 zh_TW
dc.language.isozh_TWen_US
dc.subject zh_TW
dc.subject en_US
dc.title翻轉式晶片C4接合法冶金條件之研究zh_TW
dc.titleUnder-Bump Metallurgy for Flip-Chip C4 Connectionen_US
dc.typePlanen_US
dc.contributor.department交通大學電子研究所 zh_TW
顯示於類別:研究計畫