Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing

doi:10.1149/2.0041609jss

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DC Field	Value	Language
dc.contributor.author	Lin, C. K.	en_US
dc.contributor.author	Chen, Chih	en_US
dc.contributor.author	Chu, David T.	en_US
dc.contributor.author	Tu, K. N.	en_US
dc.date.accessioned	2017-04-21T06:55:29Z	-
dc.date.available	2017-04-21T06:55:29Z	-
dc.date.issued	2016	en_US
dc.identifier.issn	2162-8769	en_US
dc.identifier.uri	http://dx.doi.org/10.1149/2.0041609jss	en_US
dc.identifier.uri	http://hdl.handle.net/11536/132917	-
dc.description.abstract	Cu3Sn is a compound commonly formed in solder joints on Cu. In this study, two different Cu3Sn structures were observed at different stages of current stressing. A normal layer-type and pore-less Cu3Sn structure was obtained at the current density of 2.27 x 10(4) A/cm(2) at 222 degrees C after 12 h. However, a porous Cu3Sn structure was formed under the same current stressing conditions after 22 h. The formation of porous Cu3Sn is explained by the mechanisms of phase transformation and reaction. The porous Cu3Sn structure is frequently observed in Cu/solder/Cu microbumps with a reduced solder height after electromigration tests. (C) 2016 The Electrochemical Society. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.title	Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing	en_US
dc.identifier.doi	10.1149/2.0041609jss	en_US
dc.identifier.journal	ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY	en_US
dc.citation.volume	5	en_US
dc.citation.issue	9	en_US
dc.citation.spage	P461	en_US
dc.citation.epage	P463	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000387983000010	en_US
Appears in Collections:	Articles