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dc.contributor.authorCheng, Chuan-Anen_US
dc.contributor.authorTsai, Tsung-Yenen_US
dc.contributor.authorHuang, Yu-Hsiangen_US
dc.contributor.authorLin, Chien-Hungen_US
dc.contributor.authorLee, Chia-Linen_US
dc.contributor.authorYang, Shan-Chunen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2017-04-21T06:56:32Z-
dc.date.available2017-04-21T06:56:32Z-
dc.date.issued2017-03en_US
dc.identifier.issn2156-3950en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCPMT.2016.2642208en_US
dc.identifier.urihttp://hdl.handle.net/11536/133143-
dc.description.abstractA new temporary bonding technology with an ultrafast laser-release process of less than 20 s is presented, where a 300-nm-thick photolysis polymer and polyimide are served as the release layer and adhesive layer, respectively. The submicrometer-thick polymer has the feature of high absorption of a 355-nm laser in contrast to polyimide during debonding procedures. In addition, the thin release layers of high chemical resistance and mechanical strength demonstrate their feasibility for handling process. Electrical characteristics of the devices before and after the laser-release process are investigated, showing no degradation. Thus, this technology scheme demonstrates its potential for temporary bonding and release in 3-D integration applications.en_US
dc.language.isoen_USen_US
dc.subject3-D integrationen_US
dc.subjectlaser ablationen_US
dc.subjecttemporary bondingen_US
dc.titleCharacterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applicationsen_US
dc.identifier.doi10.1109/TCPMT.2016.2642208en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume7en_US
dc.citation.issue3en_US
dc.citation.spage456en_US
dc.citation.epage462en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000396396200018en_US
Appears in Collections:Articles