標題: Analytical analysis and experimental verification of interleaved parallelogram heat sink
作者: Chen, Hong-Long
Wang, Chi-Chuan
機械工程學系
Department of Mechanical Engineering
關鍵字: Heat sink;Interleaved Parallelogram Fin Module;Flow impedance;Thermal resistance;Analytical prediction
公開日期: 5-Feb-2017
摘要: In this study, a novel air-cooled heat sink profile is proposed to compete with the conventional design. The new design is termed as IPFM (Interleaved Parallelogram Fin Module) which features two different geometrical perimeter shapes of fins. This new design not only gains the advantage of lower pressure drop for power saving; but also gains a material saving for less fin surface area. An assessment of flow impedance and performance between the conventional and IPFM heat sink is analytically investigated and experimentally verified. A new modified dimensionless friction factor for triangular region is proposed. The analytical predictions agree with experimental measurements for both conventional and IPFM design. In electronic cooling design, especially for cloud server air-cooled heat sink design, the flow pattern is usually laminar with Reynolds number being operated less than 2000. In this regime, the IPFM design shows 8-12% less of surface than conventional design when the flow rate is less than 10 CFM; yet the thermal performance is slightly inferior to the conventional design when the flowrate is raised towards 25 CFM. Yet in the test range of 5-25 CFM, a 10-15% lower flow impedance is observed. The smaller fin spacing, the more conspicuous reduction of flow impedance is observed. The optimization of cutting angle is around 35 degrees for 10 CFM, and it is reduced to 15 degrees at a larger flowrate of 20 CFM. (C) 2016 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.applthermaleng.2016.10.102
http://hdl.handle.net/11536/133169
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2016.10.102
期刊: APPLIED THERMAL ENGINEERING
Volume: 112
起始頁: 739
結束頁: 749
Appears in Collections:Articles