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dc.contributor.authorWu, Shu-Huaen_US
dc.contributor.authorYu, Chang-Hungen_US
dc.contributor.authorSu, Pinen_US
dc.date.accessioned2019-04-03T06:44:23Z-
dc.date.available2019-04-03T06:44:23Z-
dc.date.issued2015-11-01en_US
dc.identifier.issn2168-6734en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JEDS.2015.2475262en_US
dc.identifier.urihttp://hdl.handle.net/11536/133374-
dc.description.abstractThis paper investigates the intrinsic drain-induced barrier lowering (DIBL) characteristics for tri-gate germanium-on-insulator (GeOI) p-MOSFETs through theoretical calculation by analytical solution of 3-D Poisson's equation corroborated with TCAD numerical simulation. It is found that, relative to the silicon-on-insulator counterpart, there exists a build-in negative substrate bias in the GeOI PFET. This built-in substrate bias, stemming mainly from the large discrepancy in bandgap between Ge and Si, pulls the carriers toward the channel/BOX interface and thus degrades the DIBL of the GeOI PFET beyond what permittivity predicts. This new mechanism has to be considered when designing or benchmarking tri-gate GeOI p-MOSFETs.en_US
dc.language.isoen_USen_US
dc.subjectTri-gate MOSFETen_US
dc.subjectmulti-gate MOSFETen_US
dc.subjectGeOIen_US
dc.subjectSOIen_US
dc.subjectDIBLen_US
dc.titleNew Findings on the Drain-Induced Barrier Lowering Characteristics for Tri-Gate Germanium-on-Insulator p-MOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JEDS.2015.2475262en_US
dc.identifier.journalIEEE JOURNAL OF THE ELECTRON DEVICES SOCIETYen_US
dc.citation.volume3en_US
dc.citation.issue6en_US
dc.citation.spage441en_US
dc.citation.epage446en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000369885100001en_US
dc.citation.woscount1en_US
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