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dc.contributor.authorHsu, Chih-Weien_US
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorSu, Pinen_US
dc.date.accessioned2017-04-21T06:55:34Z-
dc.date.available2017-04-21T06:55:34Z-
dc.date.issued2015-05en_US
dc.identifier.issn2168-6734en_US
dc.identifier.urihttp://hdl.handle.net/11536/133375-
dc.description.abstractThis paper investigates and compares the impacts of metal-gate work-function variation (WFV) on III-V heterojunction tunnel FET (HTFET), homojunction TFET, and FinFET devices using a novel Voronoi method to capture the realistic metal-gate grain patterns for Technology Computer Aided Design atomistic simulations. Due to the broken-gap nature, HTFET shows significantly steeper subthreshold slope and higher susceptibility to WFV near OFF state. For ON current variation, both the HTFET and homojunction TFET show better immunity to WFV than the III-V FinFET. Device design using source-side underlap to mitigate the impact of WFV on HTFET is also assessed.en_US
dc.language.isoen_USen_US
dc.subjectWork-function variation (WFV)en_US
dc.subjectheterojunction tunnel FET (HTFET)en_US
dc.titleInvestigation and Simulation of Work-Function Variation for III-V Broken-Gap Heterojunction Tunnel FETen_US
dc.identifier.journalIEEE JOURNAL OF THE ELECTRON DEVICES SOCIETYen_US
dc.citation.volume3en_US
dc.citation.issue3en_US
dc.citation.spage200en_US
dc.citation.epage205en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000369884400016en_US
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