完整後設資料紀錄
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dc.contributor.authorChen, Yi-Mingen_US
dc.contributor.authorChang, Tai-Yuanen_US
dc.contributor.authorLai, Chiung-Huien_US
dc.contributor.authorChang, Kow-Mingen_US
dc.contributor.authorChen, Chu-Fengen_US
dc.contributor.authorLai, Yi-Lungen_US
dc.contributor.authorWhang, Allen Jong-Woeien_US
dc.contributor.authorLai, Hui-Lungen_US
dc.contributor.authorHsu, Terng-Renen_US
dc.date.accessioned2017-04-21T06:56:03Z-
dc.date.available2017-04-21T06:56:03Z-
dc.date.issued2016-02en_US
dc.identifier.issn1533-4880en_US
dc.identifier.urihttp://dx.doi.org/10.1166/jnn.2016.11919en_US
dc.identifier.urihttp://hdl.handle.net/11536/133535-
dc.description.abstractSemiconductor nanowires (NWs) have been extensively investigated and discussed in various fields due to their unique physical properties. In this paper, we successfully produce SiGe NWs biosensor by VLSI technology. We propose the dual plasma technology with CF4 plasma pre-treatment and N-2 plasma post-treatment for repairs of defects as well as optimization of SiGe NWs biosensor. The results indicate that sensitivity (S) of the biosensor with dual plasma technology has significantly improved at least 32.8%, suitable for producing industrial SiGe NWs biosensor in the future.en_US
dc.language.isoen_USen_US
dc.subjectSiGe Nanowireen_US
dc.subjectSensitivityen_US
dc.subjectSurface Stateen_US
dc.subjectOxidationen_US
dc.subjectDual Plasma Treatmenten_US
dc.subjectBiosensorsen_US
dc.titleInvestigation of Defect Free SiGe Nanowire Biosensor Modified by Dual Plasma Technologyen_US
dc.identifier.doi10.1166/jnn.2016.11919en_US
dc.identifier.journalJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGYen_US
dc.citation.volume16en_US
dc.citation.issue2en_US
dc.citation.spage1454en_US
dc.citation.epage1459en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000372358800032en_US
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