標題: The integrated circuit packaging scheduling problem (ICPSP): A case study
作者: Pearn, WL
Chung, SH
Yang, MH
Chen, CY
工業工程與管理學系
Department of Industrial Engineering and Management
關鍵字: IC packaging;parallel-machine scheduling;sequence-dependent setup time;flexible flow shop scheduling
公開日期: 1-九月-2005
摘要: The integrated-circuit-packaging scheduling problem (ICPSP) is a variation of the flexible flow-shop scheduling problem, which is also a generalization of the classical flow-shop and the identical parallel-machine problems. In this paper, we present a case study on the ICPSP. For the ICPSP we investigate, the jobs are clustered by their product types, which must be processed on groups of machines at various process stages following the manufacturing sequence, and be completed before the due dates. The job processing time depends on the product type, and the machine setup time is sequentially dependent on the orders of jobs processed. We present two efficient solution procedures to solve the ICPSP case. We generate a set of 11 ICPSP problems, which involve various setup time, processing time, and due date factors. The proposed savings approaches are shown to perform efficiently in solving the ICPSP. Significance: The integrated-circuit-packaging scheduling problem (ICPSP) is a practical but complex scheduling problem, which has many real world applications. The proposed approaches show the superiority to the traditional dispatch rules and solve the ICPSP efficiently.
URI: http://hdl.handle.net/11536/13355
ISSN: 1072-4761
期刊: INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING-THEORY APPLICATIONS AND PRACTICE
Volume: 12
Issue: 3
起始頁: 296
結束頁: 307
顯示於類別:期刊論文